Description
Universal, high-quality construction adhesive and sealant based on unique SMP technology with super fast final strength build-up. For bonding, fixing and sealing almost all (construction) materials on almost all surfaces (both smooth, porous and non-porous surfaces). Can be used indoors and outdoors. Super fast. Extra strong.
PREPARATION
Working Conditions: Only apply at temperatures between +5°C and +40°C.
Tools: Use sealant gun to handle cartridge.
APPLICATION
Coverage: Spot bonding: approx. 5-8 m²/kg. Line bonding: 8-15 m for 1 cartridge (depending on diameter of cut off nozzle).
Handling of packaging: Bonding and fixing: cut off nozzle to a diameter of at least 0.5 cm. Sealing: Cut off nozzle depending on desired joint width.
Directions for use: Bonding and fixing: Apply adhesive in lines or dots (every 10-40 cm), plus always at corners and along edges of board material. Fix material on the right spot within 10 minutes and press or tap lightly with a rubber mallet. If necessary, secure or support heavy materials for 4 hours. Can be handled after 30 minutes: the bond will be strong enough to be transported or be subjected to a light load. Max. final bond strength is reached after 4 hours, depending on substrate and working conditions.
Sealing: Apply sealant down to the bottom of the joint and tool within 10 minutes with a moist (soap water without lemon) putty knife, sealant smoother or finger. Tool vertical joints from bottom to top. Surface skin after approx. 15 minutes, complete cure after several days (depending on layer thickness).
Stains/Residue: Use white spirit to clean tools and remove fresh stains. Dried adhesive residue can only be removed mechanically.
Points of attention: The mentioned drying times are based on the bonding of at least one porous material and an adhesive layer thickness of approx. 1 mm. When bonding two non-porous materials or when the adhesive layer thickness is more than 1 mm, drying times will be significantly longer.
CURE TIMES
For detailed information about the cure times, see the Technical Documentation.
